Electrochemical Polishing of Patterned Copper Films
نویسندگان
چکیده
For decades Electrochemical Polishing (ECP) has been used for surface polishing of bulk metal materials such as copper and stainless steel. However, it was found very challenging to planarize patterned copper films electrodeposited on silicon wafers. This work studied the mechanisms of ECP, the surface profiles and ECP effects of copper bulk and films in various electrolyte solutions. Satisfied ECP effect of patterned copper films was obtained. Optimal conditions for planarization of patterned copper films were presented.
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